When comparing CM4 and CM5 I noticed that the testpoints on CM4 have their original ENIG surface while the CM5 testpoints have solder on them. What is the reason for this.
Background: I'm designing a custom io board and use 4mm high socket rows (Amphenol 10164227-1004A1RLF) and a Mill-Max 821-22-002-10-001101 pogo-pin strip in order to connect to the debug UART test pads. My fear is that the solder surface may corrode and the connections become unreliable.
Background: I'm designing a custom io board and use 4mm high socket rows (Amphenol 10164227-1004A1RLF) and a Mill-Max 821-22-002-10-001101 pogo-pin strip in order to connect to the debug UART test pads. My fear is that the solder surface may corrode and the connections become unreliable.
Statistics: Posted by fchk — Tue Mar 04, 2025 7:38 am — Replies 0 — Views 21